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Proceedings Paper

Study on synthesis of UV potting adhesive and the temperature characteristics of optical fiber coil
Author(s): Xiaole Wu; Bohan Liu; Ruoxiang Tang; Yueze Wang
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Paper Abstract

The improvement in the performance of fiber optic gyroscope raises increasingly high standard on the performance of potting adhesive for optical fiber coil. It cannot only enable the stability of coil potting, but also maintain long-term stability under complex environmental stress. In order to meet the indicators of temperature performance of optical fiber coil, we have prepared the acrylic matrix potting adhesive via UV photo-curing by grafting the hard-segment chain containing benzene ring with polyurethane acrylate(PUA) as the matrix, studied the influence of resin matrix, photoinitiator and active diluent on the UV curing of potting adhesive for optical fiber coil, and went into in details the indicators including the curing rate, modulus and glass transition temperature performance of potting adhesive so as to provide experimental support for obtaining the best matched UV potting adhesive curing system. In this study, we have characterized the molecular structure of potting adhesive via infrared spectroscopy, studied the thermomechanical properties of potting adhesive by thermal analysis, and finally verified the process stability of potting adhesive and the temperature characteristics of coil through coil winding and potting and curing.

Paper Details

Date Published: 18 December 2019
PDF: 7 pages
Proc. SPIE 11340, AOPC 2019: Optical Fiber Sensors and Communication, 113401B (18 December 2019); doi: 10.1117/12.2547778
Show Author Affiliations
Xiaole Wu, Tianjin Navigation Instrument Research Institute (China)
Bohan Liu, Tianjin Navigation Instrument Research Institute (China)
Ruoxiang Tang, Tianjin Navigation Instrument Research Institute (China)
Yueze Wang, Tianjin Navigation Instrument Research Institute (China)


Published in SPIE Proceedings Vol. 11340:
AOPC 2019: Optical Fiber Sensors and Communication
Jie Zhang; Songnian Fu; Jun Yang, Editor(s)

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