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Mechanism of crack propagation in chemical treatment process of microchannel plate
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Paper Abstract

Crack in microchannel plate (MCP) seriously reduces the mechanical and electrical properties of MCP. The mechanism of crack propagation in the chemical treatment process was revealed by studying the changes of crack morphology in acid-alkali etching and hydrogen reduction. The results show that during the acid-alkali etching process, the cracks on the channel material is dissolved by the dilute HNO3 and the cracks on the channel wall expands gradually under the etching of the NaOH solution. During the reduction process, cracks do not change significantly at the stage of heating. While at the stage of reaction with H2,the cracks are more easily expanded. The length of cracks does not change significantly after reduction. However, the surface near the cracks warps and the depth of cracks increases.

Paper Details

Date Published: 18 December 2019
PDF: 7 pages
Proc. SPIE 11338, AOPC 2019: Optical Sensing and Imaging Technology, 113382R (18 December 2019); doi: 10.1117/12.2547766
Show Author Affiliations
Jinsheng Jia, China Building Materials Academy (China)
Jiao Lian, China Building Materials Academy (China)
Xian Zhang, China Building Materials Academy (China)
Lei Zhang, China Building Materials Academy (China)
Sanzhao Wang, China Building Materials Academy (China)
Puguang Song, China Building Materials Academy (China)
Haoyang Yu, China Building Materials Academy (China)
Zhiheng Fan, China Building Materials Academy (China)


Published in SPIE Proceedings Vol. 11338:
AOPC 2019: Optical Sensing and Imaging Technology
John E. Greivenkamp; Jun Tanida; Yadong Jiang; HaiMei Gong; Jin Lu; Dong Liu, Editor(s)

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