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Proceedings Paper

Enhanced terahertz imaging of electronic packaging materials with deconvolution algorithm
Author(s): Chan Zheng; Zheyu Song; Shihan Yan; Jingbo Liu; Dongxiong Ling; Dongshan Wei; Jinyun Zhou
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Paper Abstract

This paper proposes the deconvolution image restoration algorithm, which uses the point spread function constructed by the physical characteristics of the terahertz beam to reconstruct the terahertz image and improve the image resolution[1]. At the same time, by constructing a point spread function with different penetration depths in the sample, the effect of image chromatogram on the sample can also be achieved. The integrated circuit (IC) electronic package terahertz imaging results clearly show the spatial position of the pins, internal chips and defects of the electronic packages, and analyze a variety of failure defect types, which are <1% more than the actual size.

Paper Details

Date Published: 12 March 2020
PDF: 10 pages
Proc. SPIE 11441, 2019 International Conference on Optical Instruments and Technology: IRMMW-THz Technologies and Applications, 114410D (12 March 2020); doi: 10.1117/12.2547637
Show Author Affiliations
Chan Zheng, Guangdong Univ. of Technology (China)
Dongguan Univ. of Technology (China)
Zheyu Song, Chongqing Institute of Green and Intelligent Technology (China)
Shihan Yan, Chongqing Institute of Green and Intelligent Technology (China)
Jingbo Liu, Dongguan Univ. of Technology (China)
Dongxiong Ling, Dongguan Univ. of Technology (China)
Dongshan Wei, Dongguan Univ. of Technology (China)
Jinyun Zhou, Guangdong Univ. of Technology (China)


Published in SPIE Proceedings Vol. 11441:
2019 International Conference on Optical Instruments and Technology: IRMMW-THz Technologies and Applications
Cunlin Zhang; Xi-Cheng Zhang; Zhiming Huang, Editor(s)

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