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Proceedings Paper

Performance, manufacturability, and qualification advances of high-power VCSEL arrays at TriLumina Corporation
Author(s): Thomas R. Fanning; John Maynard; Christopher J. Helms; Lei Yang; David Podva; Jeff Earls; Jacob Lopez; Michael Chung; James Foresi; Mial E. Warren; Gianluca Bacchin
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Paper Abstract

TriLumina develops and manufactures flip-chip VCSEL technology used in 3D sensing applications that must meet automotive grade 1 temperature range (-40˚C to 125˚C) performance and be tested to high reliability standards and criteria (AEC-Q102). Advances in VCSEL efficiency, performance and automotive qualification of TriLumina’s selfhermetic flip-chip VCSEL are discussed. TriLumina’s VCSEL-on-board (VoB), surface-mount technology VCSEL is introduced.

Paper Details

Date Published: 24 February 2020
PDF: 17 pages
Proc. SPIE 11300, Vertical-Cavity Surface-Emitting Lasers XXIV, 1130002 (24 February 2020); doi: 10.1117/12.2546689
Show Author Affiliations
Thomas R. Fanning, TriLumina Corp. (United States)
John Maynard, TriLumina Corp. (United States)
Christopher J. Helms, TriLumina Corp. (United States)
Lei Yang, TriLumina Corp. (United States)
David Podva, TriLumina Corp. (United States)
Jeff Earls, TriLumina Corp. (United States)
Jacob Lopez, TriLumina Corp. (United States)
Michael Chung, TriLumina Corp. (United States)
James Foresi, TriLumina Corp. (United States)
Mial E. Warren, TriLumina Corp. (United States)
Gianluca Bacchin, TriLumina Corp. (United States)

Published in SPIE Proceedings Vol. 11300:
Vertical-Cavity Surface-Emitting Lasers XXIV
Luke A. Graham; Chun Lei, Editor(s)

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