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Proceedings Paper

Short reach, low cost silicon photonic micro-transceivers for embedded and co-packaged system integration
Author(s): Kazuhiko Kurata; Richard Pitwon
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Paper Abstract

We report on the design and performance of a compact, low power, micro-transceiver chip suitable for high volume, long life deployment in high temperature (>100°C) environments. The I/O Core micro-transceiver comprises a 5mm x 5mm silicon photonics chip with a multimode interface and incorporates 4 transmit and 4 receiver channels operating at 25 Gb/s in the O-band. We will demonstrate how the I/O Core micro-transceiver may be deployed in a wide variety of packages and applications spaces including data centers, HPCs, 5G, AI and automotive systems.

Paper Details

Date Published: 28 February 2020
PDF: 11 pages
Proc. SPIE 11286, Optical Interconnects XX, 112860R (28 February 2020); doi: 10.1117/12.2546626
Show Author Affiliations
Kazuhiko Kurata, AIO Core Ltd. (Japan)
Richard Pitwon, Resolute Photonics (United Kingdom)
AIO Core Ltd. (Japan)

Published in SPIE Proceedings Vol. 11286:
Optical Interconnects XX
Henning Schröder; Ray T. Chen, Editor(s)

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