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Proceedings Paper

Investigation of magnetic-field assisted laser ablation of silicon by using short and ultrashort laser pulses (Conference Presentation)

Paper Abstract

During the last decades laser micromachining became a valuable tool for many applications in automotive, medicine, tool construction, or mobile technology. Beside the quality, processing time and production costs are crucial questions. A promising approach to achieve high throughput combined with good processing quality represent laser ablation by an assisting magnetic-field. Therefore, we studied the influence of an applied magnetic field to the ablation behaviour of silicon by using short and ultrashort laser pulses. Based on the experimental results we report on a first theoretical model that addresses the energy distribution of the heated electrons in the irradiated area.

Paper Details

Date Published: 9 March 2020
Proc. SPIE 11268, Laser-based Micro- and Nanoprocessing XIV, 112681I (9 March 2020); doi: 10.1117/12.2546458
Show Author Affiliations
Mareike Schäfer, Photonik-Zentrum Kaiserslautern e.V. (Germany)
Falicienne Gnintedem Keabou, Photonik-Zentrum Kaiserslautern e.V. (Germany)
Garik Torosyan, Photonik-Zentrum Kaiserslautern e.V. (Germany)
Yiyun Kang, Photonik-Zentrum Kaiserslautern e.V. (Germany)
Hicham Derouch, Photonik-Zentrum Kaiserslautern e.V. (Germany)
Baerbel Rethfeld, Technische Univ. Kaiserslautern (Germany)
Johannes A. L'huillier, Photonik-Zentrum Kaiserslautern e.V. (Germany)
Pavel Terekhin, Technische Univ. Kaiserslautern (Germany)

Published in SPIE Proceedings Vol. 11268:
Laser-based Micro- and Nanoprocessing XIV
Udo Klotzbach; Akira Watanabe; Rainer Kling, Editor(s)

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