Share Email Print

Proceedings Paper

Micromachining flexibility by tunable ultrashort pulse duration, pulse-on-demand, and hybrid processing from single pulse to GHz burst with TruMicro Series 2000
Author(s): Marc Sailer; Florian Jansen; Axel Fehrenbacher; Ulf Quentin; Florian Kanal; Raphael Scelle; Holger Diekamp; Chuong Tan; Markus Ginter; Patrick Sperling; Benjamin Fuehra; Christian Eberhardt; Dirk H. Sutter; Aleksander Budnicki
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Ultrafast micromachining has found broad applications in a variety of scientific and industrial fields. Different materials and competing customer requirements (surface quality vs. processing speed vs. surface structure etc.) call for parameter studies prior to volume production as well as pulse parameter flexibility during operation. Up to now, often a nonoptimized point of operation for either best speed or quality had to be chosen due to limited laser source flexibility. TruMicro Series 2000 introduces true inter- and intra-process flexibility for pulse parameters such as pulse duration, pulse energy and pulse spacing up to GHz bursts. As of now, switching the pulse duration is possible within 300 fs and 20 ps in less than 600 ms without affecting beam pointing or energy stability. Therefore, intra-process pulse parameter changes allow maximization of the ablation-volume efficiency in one step and surface-quality optimization in a second, finalizing step. Additionally, inter-process pulse parameter changes enable material changes in between workpieces. In this contribution, we show how this novel flexibility for the first time leads to comprehensive and automated parameter studies that allow for next-generation process understanding and the clear selection of enhanced points of operation. We demonstrate how ablation of various materials can be increased by employing bursts on a nanosecond timescale where a simple increase in fluence would result in cone-like protrusions. Choosing the suitable timescale for energy deposition can either maximize energy efficiency of ablation or optimize ablation quality. With the TruMicro Series 2000, both optima can be combined to one efficient, high-quality process.

Paper Details

Date Published: 2 March 2020
PDF: 13 pages
Proc. SPIE 11267, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV, 112670V (2 March 2020); doi: 10.1117/12.2546133
Show Author Affiliations
Marc Sailer, TRUMPF Laser GmbH (Germany)
Florian Jansen, TRUMPF Laser GmbH (Germany)
Axel Fehrenbacher, TRUMPF Laser GmbH (Germany)
Ulf Quentin, TRUMPF Laser- und Systemtechnik GmbH (Germany)
Florian Kanal, TRUMPF Laser- und Systemtechnik GmbH (Germany)
Raphael Scelle, TRUMPF Laser GmbH (Germany)
Holger Diekamp, TRUMPF Laser GmbH (Germany)
Chuong Tan, TRUMPF Laser GmbH (Germany)
Markus Ginter, TRUMPF Laser GmbH (Germany)
Patrick Sperling, TRUMPF Laser GmbH (Germany)
Benjamin Fuehra, TRUMPF Laser GmbH (Germany)
Christian Eberhardt, TRUMPF Laser GmbH (Germany)
Dirk H. Sutter, TRUMPF Laser GmbH (Germany)
Aleksander Budnicki, TRUMPF Laser GmbH (Germany)

Published in SPIE Proceedings Vol. 11267:
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV
Gediminas Račiukaitis; Carlos Molpeceres; Jie Qiao; Aiko Narazaki, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?