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Proceedings Paper

High quality Bessel beam generation through reflective axicon for femtosecond laser glass microprocessing (Conference Presentation)
Author(s): Antonin Billaud; Maik Steinbach; Patrick Taschner; Arndt Hohnholz; Gwenn Pallier; Sami Laroui; Pu Jian; Olivier Pinel; Jürgen Koch; Guillaume Labroille

Paper Abstract

With the development of touch panel display the need to process thinner glass using Ultra-Short Pulse (USP) laser has increased. Beam shaping improves the process yield and quality but requires specific precautions when applied to USP laser due to high peak power and dispersion. Bessel beams improve the quality of glass drilling and cutting due to the extended depth of field. We present Bessel beam generation using a reflective off-axis axicon giving a more stable beam compatible with scanning system and with a profile closer to theory. The characteristics of the beam and of the processed glass are described.

Paper Details

Date Published: 9 March 2020
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Proc. SPIE 11267, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV, 112670C (9 March 2020); doi: 10.1117/12.2545860
Show Author Affiliations
Antonin Billaud, CAILabs (France)
Maik Steinbach, Laser Zentrum Hannover e.V. (Germany)
Patrick Taschner, Laser Zentrum Hannover e.V. (Germany)
Arndt Hohnholz, Laser Zentrum Hannover e.V. (Germany)
Gwenn Pallier, CAILabs (France)
Sami Laroui, CAILabs (France)
Pu Jian, CAILabs (France)
Olivier Pinel, CAILabs (France)
Jürgen Koch, Laser Zentrum Hannover e.V. (Germany)
Guillaume Labroille, CAILabs (France)


Published in SPIE Proceedings Vol. 11267:
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV
Gediminas Račiukaitis; Carlos Molpeceres; Jie Qiao; Aiko Narazaki, Editor(s)

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