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Proceedings Paper

UV curing materials for wafer level optics
Author(s): M. Brehm; C. Ertl; I. Pilottek; P. Heissler
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Paper Abstract

Wafer level imprinting using transparent UV curable materials offers high flexibility in design, scalability and low total cost of ownership. Development of materials requires a careful balancing of all relevant properties including optical function, process constraints, (thermo-) mechanical properties and stability under reliability testing. DELO developed a modular system of materials which can be modified in this wide parameter space. These materials include highly transparent materials with refractive indices starting at below 1.4 and stretching to above 1.7 and also excellent mechanical as well as reliability performance.

Paper Details

Date Published: 28 February 2020
PDF: 8 pages
Proc. SPIE 11292, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XIII, 112920I (28 February 2020); doi: 10.1117/12.2545767
Show Author Affiliations
M. Brehm, DELO Industrial Adhesives (Germany)
C. Ertl, DELO Industrial Adhesives (Germany)
I. Pilottek, DELO Industrial Adhesives (Germany)
P. Heissler, DELO Industrial Adhesives (Germany)

Published in SPIE Proceedings Vol. 11292:
Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XIII
Georg von Freymann; Eva Blasco; Debashis Chanda, Editor(s)

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