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Proceedings Paper

Scaling laser shock peening process towards high repetition rates: a demonstration on industrial grade Al2024-T351
Author(s): G. LaFoy; J. Bergon; K. Aouati; R. Kling; T. Palin-Luc
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Paper Abstract

Micro laser shock peening (μLSP) with pulse energies well below 1 J proved to be a useful technique to obtain fatiguelife performances similar to those reported for traditional LSP processes on metallic bulk materials [1, 2]. However, it suffers from a lack of productivity as spot sizes are reduced and pulse overlaps are increased in order to obtain compressive residual stresses, deep below the surface of the bulk material. To overcome these limitations of μLSP, we have investigated strategies to scale up the productivity by increasing laser repetition rate while keeping constant the total amount of energy deposited on the peened surface [3-5]. We have built a laser processing cell to meet industrial grade applications. Complex surfaces are mounted on a KUKA robot to control the laser orientation and pulse overlap on the 3D workpiece surface. The pulse energy is provided by an 8 ns, Nd:YAG Laser, operating at 1064 nm, with a variable repetition rate from 10 to 100 Hz and delivering a maximum energy of 450 mJ/pulse on Al 2024-T351 samples with a thickness of 10 mm. We present high speed video analysis as diagnostic tool illustrating limitations in upscaling of repetition rates. As a proof of the μLSP effectiveness we present compressive residual stress profiles with up to -500 MPa peak and a return to zero down to 1.8 mm below the surface. This represents a 5-times improvement of the maximum stress depth, when compared to conventional peening processes widely used in the aeronautic industry.

Paper Details

Date Published: 2 March 2020
PDF: 9 pages
Proc. SPIE 11273, High-Power Laser Materials Processing: Applications, Diagnostics, and Systems IX, 1127305 (2 March 2020); doi: 10.1117/12.2545760
Show Author Affiliations
G. LaFoy, ALPhANOV Technology Ctr. (France)
J. Bergon, ALPhANOV Technology Ctr. (France)
K. Aouati, ALPhANOV Technology Ctr. (France)
R. Kling, ALPhANOV Technology Ctr. (France)
T. Palin-Luc, Arts et Metiers ParisTech, CNRS, Univ. of Bordeaux (France)

Published in SPIE Proceedings Vol. 11273:
High-Power Laser Materials Processing: Applications, Diagnostics, and Systems IX
Stefan Kaierle; Stefan W. Heinemann, Editor(s)

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