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Proceedings Paper

Injection molded low-thermal-expansion multi-fiber ferrule
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Paper Abstract

Hybrid injection-molded ferrules are presented which consist of a polymer body and an over-molded glass insert. The average coefficient of thermal expansion observed at the front face of the ferrules is 8 ppm/C from room temperature to 100 C. This design could be applicable for direct heterogeneous re-matable connections between fiber ribbons and photonic integrated circuits which exhibit low thermal expansion and operate at elevated temperatures.

Paper Details

Date Published: 28 February 2020
PDF: 7 pages
Proc. SPIE 11286, Optical Interconnects XX, 112860T (28 February 2020); doi: 10.1117/12.2545040
Show Author Affiliations
Ulrich W. Neukirch, Corning Research and Development Corp. (United States)
Woraphat Dockchoorung, Corning Research and Development Corp. (United States)
Stephen Q. Smith, Corning Research and Development Corp. (United States)
Robert A. Bellman, Corning Research and Development Corp. (United States)
Esteban Marin, Corning Research and Development Corp. (United States)
Darrell Childers, US Conec Ltd. (United States)
DJ Hastings, US Conec Ltd. (United States)


Published in SPIE Proceedings Vol. 11286:
Optical Interconnects XX
Henning Schröder; Ray T. Chen, Editor(s)

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