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Proceedings Paper

High throughput LIFT printing of electric circuitry
Author(s): Sharona Sedghani Cohen; Oleg Ermak; Itay Peled; Zvi Kotler
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Paper Abstract

Laser Induced Forward Transfer (LIFT) is a digital, non-contact printing technology of solid metals as well as viscous inks and pastes. It is highly promising for various printed electronics applications, also when high-resolution is required given its versatility in printable materials, controlled droplet volume down to <100 fL and accurate positioning down to <~5μm. Moreover, since typically no post-processing is required, deposition on a wide range of sensitive substrates is made possible. We will demonstrate high speed and high-resolution LIFT printing of electrical circuitry relying on fast material supply in the form of metal coated foil and fast, random access, laser beam steering. Examples of printed porous material structures will be shown as a demonstration to the capacity to design and fabricate materials with specific thermal, electrical and mechanical properties.

Paper Details

Date Published: 2 March 2020
PDF: 7 pages
Proc. SPIE 11271, Laser 3D Manufacturing VII, 112710C (2 March 2020); doi: 10.1117/12.2544751
Show Author Affiliations
Sharona Sedghani Cohen, Orbotech Ltd. (Israel)
Oleg Ermak, Orbotech Ltd. (Israel)
Itay Peled, Orbotech Ltd. (Israel)
Zvi Kotler, Orbotech Ltd. (Israel)


Published in SPIE Proceedings Vol. 11271:
Laser 3D Manufacturing VII
Bo Gu; Hongqiang Chen; Henry Helvajian, Editor(s)

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