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Proceedings Paper

Low-power reconfigurable photonic integrated circuits fabricated by femtosecond laser micromachining (Conference Presentation)
Author(s): Francesco Ceccarelli; Simone Atzeni; Francesco Pellegatta; Simone Piacentini; Andrea Crespi; Roberto Osellame

Paper Abstract

Femtosecond laser micromachining (FLM) is considered today a key technology for the fabrication of high-quality photonic integrated circuits, especially when a 3D geometry is required. However, when a thermal phase shifter is exploited to reconfigure an FLM device, its operation requires many hundreds of milliwatts. This issue strongly limits the scalability of these circuits. With this work, we present a new FLM fabrication process that takes advantage of thermally insulating microstructures (i.e. trenches and bridge waveguides) to demonstrate low propagation losses (0.29 dB/cm at 1550 nm), along with a power dissipation for a 2π phase shift down to 37 mW.

Paper Details

Date Published: 9 March 2020
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Proc. SPIE 11270, Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XX, 112700U (9 March 2020); doi: 10.1117/12.2544669
Show Author Affiliations
Francesco Ceccarelli, Consiglio Nazionale delle Ricerche (Italy)
Politecnico di Milano (Italy)
Simone Atzeni, Consiglio Nazionale delle Ricerche (Italy)
Politecnico di Milano (Italy)
Francesco Pellegatta, Consiglio Nazionale delle Ricerche (Italy)
Politecnico di Milano (Italy)
Simone Piacentini, Consiglio Nazionale delle Ricerche (Italy)
Politecnico di Milano (Italy)
Andrea Crespi, Consiglio Nazionale delle Ricerche (Italy)
Politecnico di Milano (Italy)
Roberto Osellame, Consiglio Nazionale delle Ricerche (Italy)
Politecnico di Milano (Italy)


Published in SPIE Proceedings Vol. 11270:
Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XX
Peter R. Herman; Michel Meunier; Roberto Osellame, Editor(s)

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