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Proceedings Paper

Building blocks of a scalable and radiation-hardened integrated transmitter unit based on 250 nm SOI
Author(s): Y. Zhang; M. Schneider; D. Karnick; L. Eisenblätter; T. Kühner; M. Weber
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Paper Abstract

One promising solution for the ever increasing transmission capacity demand from fundamental research and data centers is the silicon-photonic integrated WDM transmitter. We designed an easily scalable, high-bandwidth transmitter unit composed of radiation-hardened Mach-Zehnder modulators (MZMs) and Echelle grating (de-)multiplexers (EG-DMUXs).

Our 3 mm MZMs have customized slabs with a reduced etch depth to improve their radiation hardness. Our current MZMs feature a Vπ∙L of 4.6 V∙cm and an insertion loss of 4.84 dB. Additionally, an error-free transmission was achieved successfully at a speed of 11.3 Gb/s while driving the modulators with a PRBS-7 signal and an amplitude of less than 2 Vpp.

The Echelle grating (de-)multiplexers were designed and simulated numerically. The presented 1x7 device is compact and low-loss: the on-chip footprint is 680 μm × 380 μm, the channel spacing is 800 GHz, and the measured average insertion loss and crosstalk are 2.5 dB and -22 dB, respectively. With optimized components, higher bandwidth systems with more channels are achievable.

Paper Details

Date Published: 28 February 2020
PDF: 7 pages
Proc. SPIE 11286, Optical Interconnects XX, 112860P (28 February 2020);
Show Author Affiliations
Y. Zhang, Karlsruhe Institute of Technology (Germany)
M. Schneider, Karlsruhe Institute of Technology (Germany)
D. Karnick, Karlsruhe Institute of Technology (Germany)
L. Eisenblätter, Karlsruhe Institute of Technology (Germany)
T. Kühner, Karlsruhe Institute of Technology (Germany)
M. Weber, Karlsruhe Institute of Technology (Germany)


Published in SPIE Proceedings Vol. 11286:
Optical Interconnects XX
Henning Schröder; Ray T. Chen, Editor(s)

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