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Proceedings Paper

Study for evaluation of skin aging with photoacoustic microscopy
Author(s): Hiroki Hattori; Takeshi Namita; Kengo Kondo; Makoto Yamakawa; Tsuyoshi Shiina
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Paper Abstract

Skin aging caused by ultraviolet light exposure is one of the serious problems from the viewpoint of beauty and healthcare. This is because ultraviolet light can cause age spot, wrinkles, at the worst case, skin cancer and so on. To evaluate skin aging, various modalities are being used, such as histopathological diagnosis, optical coherence tomography, ultrasound examination (B-mode imaging). However, they have disadvantages in terms of invasiveness, penetration depth and tissue specificity, respectively. To overcome these defects, photoacoustic imaging (PAI), a novel modality was used in this work. This modality can portray differences of tissue characteristics non-invasively. In this experiment, human skin tissues in various generations (i.e. various degrees of photo-aging) were measured by using optical resolution photoacoustic microscopy (OR-PAM) and acoustic resolution photoacoustic microscopy (AR-PAM). To verify the feasibility of quantitative skin aging evaluation with PA technique, signals from sectioned human skin (cheek and buttock; female from 28 to 95 years old) were measured with PA microscopy. The effects of photo-aging progress on the signal intensity were investigated. The results demonstrated that the PA signal from the dermis increases with aging progress. These analyses demonstrate the feasibility of quantitative skin aging evaluation with a PA imaging system.

Paper Details

Date Published: 17 February 2020
PDF: 5 pages
Proc. SPIE 11240, Photons Plus Ultrasound: Imaging and Sensing 2020, 112400C (17 February 2020);
Show Author Affiliations
Hiroki Hattori, Kyoto Univ. (Japan)
Takeshi Namita, Kyoto Univ. (Japan)
Kengo Kondo, Kyoto Univ. (Japan)
Makoto Yamakawa, Kyoto Univ. (Japan)
Tsuyoshi Shiina, Kyoto Univ. (Japan)


Published in SPIE Proceedings Vol. 11240:
Photons Plus Ultrasound: Imaging and Sensing 2020
Alexander A. Oraevsky; Lihong V. Wang, Editor(s)

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