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Proceedings Paper

High-density optical module for on-board optical interconnects utilizing graded-index core polymer waveguide (Conference Presentation)
Author(s): Naohiro Kohmu; Maho Ishii; Takaaki Ishigure

Paper Abstract

Recently, with the increasing traffic in data centers (DCs) and the evolution of high-performance computers (HPCs), large-capacity data transmission has been required in DC and HPC networks. To take advantage of optical interconnects with the capability of transmitting high-speed signals under high wiring density, we have proposed active optical modules for inter-rack interconnects in DC and HPC networks. In order to satisfy the higher bandwidth demand, not only the inter-rack interconnects but also on-board interconnects are required to have a high density. In this paper, we propose a high-density optical module utilizing graded-index (GI) polymer waveguide for on-board optical interconnects.

Paper Details

Date Published: 9 March 2020
Proc. SPIE 11286, Optical Interconnects XX, 112860J (9 March 2020); doi: 10.1117/12.2544341
Show Author Affiliations
Naohiro Kohmu, Hitachi, Ltd. (Japan)
Keio Univ. (Japan)
Maho Ishii, Keio Univ. (Japan)
Takaaki Ishigure, Keio Univ. (Japan)

Published in SPIE Proceedings Vol. 11286:
Optical Interconnects XX
Henning Schröder; Ray T. Chen, Editor(s)

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