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Proceedings Paper

Laser process of transparent conducting surfaces for terahertz bandpass ultrathin metamaterials
Author(s): Qinghua Wang; Bingtao Gao; Fatima Toor; Mark Arnold; Hongtao Ding
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Paper Abstract

Terahertz (THz) optoelectronics have great potentials in communication, imaging, sensing and security applications. However, the state-of-the-art fabrication processes for THz devices are costly and time-consuming. In this work, we present a novel laser-based metamaterial fabrication (LMF) process for high-throughput fabrication of transparent conducting surfaces on dielectric substrates such as quartz and transparent polymers to achieve tunable THz bandpass filtering characteristics. The LMF process comprises two steps: (1) applying ultrathin-film metal deposition, with a typical thickness of 10 nm, on the dielectric substrate; (2) creating periodic surface pattern with a feature size of ~100 microns on the metal film using nanosecond pulsed laser ablation. Our results demonstrate the LMF-fabricated ultra-thin metal film exhibits newly integrated functionalities: (a) highly conductive with sheet resistance of ~20 Ω/sq; (b) optically transparent with visible transmittance of ~70%; (c) tunable bandpass filtering effect in the THz frequency range; and (d) extraordinary mechanical durability during repeated fatigue bending cycles. The scientific findings from this work will render an economical and scalable manufacturing technique capable of treating large surface area for multi-functional THz metamaterials.

Paper Details

Date Published: 2 March 2020
PDF: 11 pages
Proc. SPIE 11268, Laser-based Micro- and Nanoprocessing XIV, 112680H (2 March 2020); doi: 10.1117/12.2544054
Show Author Affiliations
Qinghua Wang, The Univ. of Iowa (United States)
Bingtao Gao, The Univ. of Iowa (United States)
Fatima Toor, The Univ. of Iowa (United States)
Mark Arnold, The Univ. of Iowa (United States)
Hongtao Ding, The Univ. of Iowa (United States)

Published in SPIE Proceedings Vol. 11268:
Laser-based Micro- and Nanoprocessing XIV
Udo Klotzbach; Akira Watanabe; Rainer Kling, Editor(s)

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