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The effect of grinding processing parameters on aspheric small-scale waviness
Author(s): Qiancai Wei; Lian Zhou; Xianhua Chen; Jie Li; Qinghua Zhang; Jian Wang
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Paper Abstract

Small scale waviness of aspheric surface inevitably occurs when grinding aspheric surface with grating parallel grinding technology, so aiming at the problem of waviness amplitude and uniformity, this paper theoretically analyses the relationship between grinding processing parameters and aspheric waviness, and designs a single factor experiment to verify the influence of grinding processing parameters on aspheric surface waviness. The processing parameters are determined to minimize the waviness amplitude. Considering the problem of uniformity of waviness, according to the influence of grinding force on uniformity of aspheric waviness in grinding process, down-grinding grating parallel grinding method and up-grinding grating parallel grinding method are used. Experiments verify that down-grinding grating parallel grinding method is the best method to get most uniformity small-scale waviness of aspheric surface. The minimum amplitude is 0.5μm~1.5μm.

Paper Details

Date Published: 18 December 2019
PDF: 10 pages
Proc. SPIE 11342, AOPC 2019: AI in Optics and Photonics, 113420C (18 December 2019); doi: 10.1117/12.2543501
Show Author Affiliations
Qiancai Wei, China Academy of Engineering Physics (China)
Lian Zhou, China Academy of Engineering Physics (China)
Xianhua Chen, China Academy of Engineering Physics (China)
Jie Li, China Academy of Engineering Physics (China)
Qinghua Zhang, China Academy of Engineering Physics (China)
Jian Wang, China Academy of Engineering Physics (China)


Published in SPIE Proceedings Vol. 11342:
AOPC 2019: AI in Optics and Photonics
John Greivenkamp; Jun Tanida; Yadong Jiang; HaiMei Gong; Jin Lu; Dong Liu, Editor(s)

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