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Proceedings Paper

Optimization of solder reflow processing and part design in thermoplastic optical interconnect components
Author(s): Peter M. Johnson; Takamune Sugawara; Norihiko Ohno; Gabrie Hoogland
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Paper Abstract

Thermoplastic polyetherimides (ULTEM™ and EXTEM™ resins) have been used to produce complex optical lenses and ferrules that are integrated in optical interconnect sub-assemblies. Current thermoplastic optics must be added separately to prevent dimensional changes from the 260°C peak temperature of a solder reflow process. This paper covers injection molding parameters and solder reflow conditions that influence optical properties and dimensional stability of solder-reflowable test components.

Paper Details

Date Published: 25 February 2020
PDF: 8 pages
Proc. SPIE 11283, Integrated Optics: Devices, Materials, and Technologies XXIV, 112831U (25 February 2020); doi: 10.1117/12.2543215
Show Author Affiliations
Peter M. Johnson, SABIC (United States)
Takamune Sugawara, SABIC Japan LLC (Japan)
Norihiko Ohno, SABIC Japan LLC (Japan)
Gabrie Hoogland, SABIC (Netherlands)

Published in SPIE Proceedings Vol. 11283:
Integrated Optics: Devices, Materials, and Technologies XXIV
Sonia M. García-Blanco; Pavel Cheben, Editor(s)

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