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Proceedings Paper

3D optical measuring and data processing applied in flexible electronics manufacturing
Author(s): Fuquan Jin; Sheng Feng; Yong-an Huang; Wenlong Li
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Paper Abstract

Flexible-electronics is gaining increasing popularity in microelectronics such as flexible display, smart skin, epidermal electronics and soft robotics due to cost-effective fabrication and possibility of obtaining multifunctional electronics over large areas. Distinct from conventional microelectronics, flexible curved substrate such as polyimide has been adopted in the flexible-electronics manufacturing process. Hence, how to measure the curved surfaces of the substrates in a precise and fast way has become a key issue. Traditionally, the curved surfaces are usually measured in a coordinate measuring machine (CMM). However, the polyimide substrates (<1mm) are so thin that they are vulnerable to be scratched and deformed. To solve the problem, this paper presents a 3D measuring system based on the laser displacement sensor, high precision motion platform and programmable multi-axis controller (PMAC). Meanwhile, to process the measured data and inspect the machining quality of the substrate by using the 3D matching methods, a software called iPoint3D was developed.

Paper Details

Date Published: 16 October 2019
PDF: 11 pages
Proc. SPIE 11205, Seventh International Conference on Optical and Photonic Engineering (icOPEN 2019), 112050M (16 October 2019); doi: 10.1117/12.2542246
Show Author Affiliations
Fuquan Jin, Guangdong Sygole Intelligent Technology Co., Ltd. (China)
Huazhong Univ. of Science and Technology (China)
Sheng Feng, Huazhong Univ. of Science and Technology (China)
Yong-an Huang, Huazhong Univ. of Science and Technology (China)
Wenlong Li, Huazhong Univ. of Science and Technology (China)

Published in SPIE Proceedings Vol. 11205:
Seventh International Conference on Optical and Photonic Engineering (icOPEN 2019)
Anand Asundi; Motoharu Fujigaki; Huimin Xie; Qican Zhang; Song Zhang; Jianguo Zhu; Qian Kemao, Editor(s)

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