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Proceedings Paper

The design of Si-based Fresnel-zone lens for 3D IC optical interconnect applications
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Paper Abstract

In this work, we design a Si-based Fresnel-zone lens for a hybrid 3D integrated circuit (3D IC) solution. The 3D IC solution consists of two layers of transceiver modules which are mounted at several points on an optical printed circuit board (OPCB) for seamless transmission of signal through each layer to the OPCB and vice versa. Each transceiver module is made up of a Si-subcarrier (Si layer), transceiver IC, laser diode (VCSEL) and photodiode (PD). The transceiver IC, LD and PD are flip-chip bonded to the Si-subcarrier. Fresnel-zone lens are designed on the transmission surface of each of the Si-subcarriers to improve coupling efficiency, transmittance through the silicon substrate, reduce surface scattering, and improve focusing. Each of the Si-subcarrier with the transceiver modules are flip-chip bonded together and also flip-chip bonded to the optical PCB. A 2-level and 4-level Fresnel-zone lens are designed at 1.3μm and 1.55μm. Based on design parameters such as coupling efficiency, transmittance, less design complexity, and ease of fabrication, the 4-level Fresnel zone lens was selected as the optimal design for 3D IC and optical PCB applications. The optimal 4-level Fresnel-zone lens are designed for λ=1.3μm, where the focal length, f is 350μm, and diameter, D, is 167μm; and for λ=1.55μm, where the focal length, f is 350μm, and diameter, D, is 169.2μm. Also the plots of coupling efficiency and transmittance are provided for applications in 3D IC optical interconnects.

Paper Details

Date Published: 26 February 2020
PDF: 6 pages
Proc. SPIE 11284, Smart Photonic and Optoelectronic Integrated Circuits XXII, 1128422 (26 February 2020); doi: 10.1117/12.2541816
Show Author Affiliations
Ikechi A. Ukaegbu, Nazarbayev Univ. (Kazakhstan)
Hyo-Hoon Park, Korea Advanced Institute of Science and Technology (Korea, Republic of)

Published in SPIE Proceedings Vol. 11284:
Smart Photonic and Optoelectronic Integrated Circuits XXII
Sailing He; Laurent Vivien, Editor(s)

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