Share Email Print

Proceedings Paper

Advanced solderless flexible thermal link
Author(s): Brian G. Williams; Scott M. Jensen; J. Clair Batty
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Flexible thermal links play an important role int he thermal management of cryogenically cooled components. The purpose of these links is to provide a means of transferring heat from a cooled component to a cooler reservoir with little increase in temperature. The standard soldered approach although effective proves to be time consuming and contributes to added thermal impedances which degrade the performance of the link. For system with little tolerance for temperature differences between cooled components and a cooling source this is undesirable. The authors of this paper have developed a technique by which thin metal foil or braided wire can be attached to metal end blocks without any solder using the swaging process. Swaging provides a fast, simple method for providing a low thermal impedance between the foils and blocks. This paper describes the characteristics of these thermal links in terms of length, mass, thermal resistance, flexibility, and survivability.

Paper Details

Date Published: 14 October 1996
PDF: 8 pages
Proc. SPIE 2814, Cryogenic Optical Systems and Instruments VII, (14 October 1996); doi: 10.1117/12.254144
Show Author Affiliations
Brian G. Williams, Utah State Univ. (United States)
Scott M. Jensen, Utah State Univ. Space Dynamics Lab. (United States)
J. Clair Batty, Utah State Univ. Space Dynamics Lab. (United States)

Published in SPIE Proceedings Vol. 2814:
Cryogenic Optical Systems and Instruments VII
Lawrence G. Burriesci; James B. Heaney, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?