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Proceedings Paper

Laser modulation simulation of micro-crack morphology evolution during chemical etching
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Paper Abstract

Subsurface micro-cracks will be generated during the grinding and polishing processes of optical components. Microcracks have a modulation effect on the laser, thereby reducing the laser damage threshold. The FDTD method is used to simulate the light intensity distribution modulated by micro-crack. By comparing the simulation results of radial crack, parabolic crack and elliptic crack, the modulation mechanism of micro-crack is revealed. The results show that for the crack with the same width and depth, light intensity enhancement factor (LIEF) modulated by radial crack on the rear surface and parabolic crack on the front surface is the largest; LIEF modulated by elliptical crack on the rear surface and radial crack on the front surface is the smallest. In addition, when the crack width-depth ratio is the same, the larger the depth, the higher the LIEF. As the width-depth ratio increases, the LIEF value increases firstly, then decreases, and finally approaches a stable value.

Paper Details

Date Published: 8 July 2019
PDF: 9 pages
Proc. SPIE 11063, Pacific Rim Laser Damage 2019: Optical Materials for High-Power Lasers, 110631H (8 July 2019); doi: 10.1117/12.2540729
Show Author Affiliations
Zhi Chen, Xi'an Jiaotong Univ. (China)
Huapan Xiao, Xi'an Jiaotong Univ. (China)
College of Optical Sciences, Univ. of Arizona (United States)
Zhibin Li, Xi'an Jiaotong Univ. (China)
Na Yu, Xi'an Jiaotong Univ. (China)
Hairong Wang, Xi'an Jiaotong Univ (China)
Rongguang Liang, College of Optical Sciences, Univ. of Arizona (United States)


Published in SPIE Proceedings Vol. 11063:
Pacific Rim Laser Damage 2019: Optical Materials for High-Power Lasers
Jianda Shao; Takahisa Jitsuno; Wolfgang Rudolph, Editor(s)

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