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Fabrication tolerant planar directional couplers
Author(s): C. K. Lai; Y. L. Zhong; T. Han; W. Y. Chong; D. Y. Choi; H. D. K. Goldsmith; P. Ma; H. Ahmad; S. Madden
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Paper Abstract

Hybrid integration of different materials will allow for different functionalities such as passive, amplifying, nonlinear, electro-optic, detection etc to build “system on a chip” devices. The vertically stacked layer design commonly proposed significantly increases the difficulty of the lithography process for the bottom-most layer due to the overlying topology. A methodology for significantly improving the fabrication tolerance of planar directional couplers is therefore presented. A parametric design study reveals that significant dimensional sensitivity improvements exist for certain center-to-center spacings for both power and wavelength splitters.

Paper Details

Date Published: 30 December 2019
PDF: 3 pages
Proc. SPIE 11200, AOS Australian Conference on Optical Fibre Technology (ACOFT) and Australian Conference on Optics, Lasers, and Spectroscopy (ACOLS) 2019, 1120033 (30 December 2019); doi: 10.1117/12.2540497
Show Author Affiliations
C. K. Lai, The Australian National Univ. (Australia)
Y. L. Zhong, The Australian National Univ. (Australia)
T. Han, The Australian National Univ. (Australia)
W. Y. Chong, Univ. of Malaya (Malaysia)
D. Y. Choi, The Australian National Univ. (Australia)
H. D. K. Goldsmith, The Australian National Univ. (Australia)
P. Ma, The Australian National Univ. (Australia)
H. Ahmad, Univ. of Malaya (Malaysia)
S. Madden, The Australian National Univ. (Australia)


Published in SPIE Proceedings Vol. 11200:
AOS Australian Conference on Optical Fibre Technology (ACOFT) and Australian Conference on Optics, Lasers, and Spectroscopy (ACOLS) 2019
Arnan Mitchell; Halina Rubinsztein-Dunlop, Editor(s)

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