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Proceedings Paper

High power 250W CW conductively cooled diode laser arrays with low-smile
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Paper Abstract

We have simulated and optimized a conductive cooling structure including the distribution of temperature in active layer, and the deformation of laser to achieve high power operation with low SMILE value. Unlike the traditional conductive cooling structure, our structure improves the heat dissipation efficiency from three aspects: with angle structure in the front of heat sink; double side heat dissipation and without submount packaging technology. In this report, an output power of more than 250W CW from a 4 mm long laser bar with a filling factor of 50% is shown at 240A driving current with a power conversion efficiency of 65%. The thermal rollover of this packaging conductive cooling device can reach 385W at 400A driving current.

Paper Details

Date Published: 21 February 2020
PDF: 11 pages
Proc. SPIE 11261, Components and Packaging for Laser Systems VI, 112610C (21 February 2020); doi: 10.1117/12.2540399
Show Author Affiliations
Hongyou Zhang, Xi'an Institute of Optics and Precision Mechanics (China)
Univ. of Chinese Academy of Sciences (China)
Focuslight Technologies, Inc. (China)
Pengfei Zhu, Focuslight Technologies, Inc. (China)
Tuanwei Fu, Focuslight Technologies, Inc. (China)
Meiqin Li, Focuslight Technologies, Inc. (China)
Ning Lv, Focuslight Technologies, Inc. (China)
Wenwei Li, Focuslight Technologies, Inc. (China)
Chung-en Zah, Focuslight Technologies, Inc. (China)
Xingsheng Liu, Univ. of Chinese Academy of Sciences (China)
Focuslight Technologies, Inc. (China)

Published in SPIE Proceedings Vol. 11261:
Components and Packaging for Laser Systems VI
Alexei L. Glebov; Paul O. Leisher, Editor(s)

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