Share Email Print

Proceedings Paper

Preparation of silica thin film by hot pressing process for passive radiative cooling
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Thin films have been widely used, and their preparation methods are varied. In this paper, a new type of hot pressing process is introduced to fabricate silicon dioxide thin films based on PET. The thickness of the prepared silica film is up to 40 microns, and the film is transparent. The SiO2 thin films were deposited uniformly on Polyethylene terephthalate (PET) without obvious cracks, and the films could also be crimped. The prepared silicon dioxide films have the ability of passive radiative cooling, that is, the temperature of the films can reduce to lower than that of the ambient air. It can be expected that this method is also suitable for the preparation of other thin films.

Paper Details

Date Published: 8 July 2019
PDF: 6 pages
Proc. SPIE 11064, Tenth International Conference on Thin Film Physics and Applications (TFPA 2019), 1106404 (8 July 2019); doi: 10.1117/12.2539200
Show Author Affiliations
Zhenfei Zhang, Wuhan Univ. of Technology (China)
Dengwu Liu, Wuhan Univ. of Technology (China)
Zhilin Xia, Wuhan Univ. of Technology (China)

Published in SPIE Proceedings Vol. 11064:
Tenth International Conference on Thin Film Physics and Applications (TFPA 2019)
Junhao Chu; Jianda Shao, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?