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Proceedings Paper

Novel hybrid adhesive material based on thiol-ene system for nano-conglutination technology
Author(s): Man Zhang; Liangping Xia; Suihu Dang; Chunlei Du
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Paper Abstract

Nano-conglutination technology is a nonconventional nanofabrication technique to use adhesive materials to “stick” nanostructures, which relies on excellent properties of adhesive materials. In this article, we propose a novel hybrid material based on thiol-ene system as the adhesive material for nano-conglutination technology. Thiol-ene system is a kind of UV-curable polymer via “click reaction” to form cross-linked network, which is low viscosity, rapid polymerization rate, high Young’s modulus, and low cost. High-resolution nanostructures such as nano-bowl and nanopillar arrays with sub-200 nm resolution are achieved using thiol-ene adhesive material via nano-conglutination technology. Special reactions of thiols with reactive carbon-carbon double bonds happen in the crosslink process, which make the thiol-ene system be enough low viscosity to keep conformal with the stuck nanostructures and be enough high rigid to easily separate from the mold and keep the original arrangement of nanostructures. This study promotes nanostructures for potential applications of optical, electronics, and photonic devices due to the surface plasmon resonance, surface enhanced Raman spectroscopy, electrical effect, and nonlinear optical response.

Paper Details

Date Published: 18 November 2019
PDF: 8 pages
Proc. SPIE 11193, Nanophotonics and Micro/Nano Optics V, 111931E (18 November 2019); doi: 10.1117/12.2538193
Show Author Affiliations
Man Zhang, Yangtze Normal Univ. (China)
Institute of Optics and Electronics (China)
Liangping Xia, Yangtze Normal Univ. (China)
Chongqing Institute of Green and Intelligent Technology (China)
Suihu Dang, Yangtze Normal Univ. (China)
Chunlei Du, Yangtze Normal Univ. (China)
Chongqing Institute of Green and Intelligent Technology (China)

Published in SPIE Proceedings Vol. 11193:
Nanophotonics and Micro/Nano Optics V
Zhiping Zhou; Kazumi Wada; Limin Tong, Editor(s)

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