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Proceedings Paper

Full-color LED integration based on adhesive bonding for micro-LED display applications (Conference Presentation)
Author(s): Dong-Seon Lee

Paper Abstract

Recently, researches on the micro-displays using inorganic LEDs have stirred much attentions due to its various advantages such as reduced power consumption, long life time and short response time. In this study, we achieved a full-color integration of LEDs for display applications by combining growth and bonding technologies with two different approaches. First method was integrating inorganic red, green, and blue LEDs on a single substrate using metalorganic chemical vapor deposition and thin film bonding techniques. Second method was fabricating inorganic red, green, and blue LEDs by using GaN-on-Si-based blue LEDs and adhesive bonding.

Paper Details

Date Published: 9 March 2020
Proc. SPIE 11302, Light-Emitting Devices, Materials, and Applications XXIV, 1130205 (9 March 2020); doi: 10.1117/12.2537958
Show Author Affiliations
Dong-Seon Lee, Gwangju Institute of Science and Technology (Korea, Republic of)

Published in SPIE Proceedings Vol. 11302:
Light-Emitting Devices, Materials, and Applications XXIV
Jong Kyu Kim; Michael R. Krames; Martin Strassburg, Editor(s)

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