Share Email Print

Proceedings Paper

Visual inspection machine for solder joints using tiered illumination
Author(s): Yuji Takagi; Seiji Hata; Susumu Hibi; Wilhelm Beutel
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

We have developed a visual inspection machine for solder int defects of SMDS (Surface Mount Devices) mounted on PCBs (Printed Circuit Boards). The change of the intensity of the reflected light obtained by illuminating the soldered surface from different incident angles depends on the gradient of the soldered surface. We generate an images that represents this change of intensity and analyze this image to inspect the solder joint defects. In addition we report on an automatic generation program of the NC data for inspection.

Paper Details

Date Published: 1 March 1991
PDF: 9 pages
Proc. SPIE 1386, Machine Vision Systems Integration in Industry, (1 March 1991); doi: 10.1117/12.25375
Show Author Affiliations
Yuji Takagi, Hitachi, Ltd. (Japan)
Seiji Hata, Hitachi, Ltd. (Japan)
Susumu Hibi, Hitachi, Ltd. (Japan)
Wilhelm Beutel, Siemens AG (Germany)

Published in SPIE Proceedings Vol. 1386:
Machine Vision Systems Integration in Industry
Bruce G. Batchelor; Frederick M. Waltz, Editor(s)

© SPIE. Terms of Use
Back to Top