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Manufacturing methods and challenges in structural electronics
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Paper Abstract

Development of the three-dimensional printing made, that these techniques are more widely used. Initially, it was invented for quick prototypes manufacturing and models making, then adopted for final parts or even tools producing and nowadays even human organs and microstructures, smaller than human hair, can be 3D printed. It is not surprising, that these methods are adopted for electronics manufacturing, which gave the different approach of circuits producing called structural electronics. In this idea, electrical and mechanical modules are merged together what has great potential in building complex, multifunctional devices with limited sizes and weight. In this paper, a brief overview of structural electronics manufacturing methods are presented on both, industrial and academic, levels. Advantages and disadvantages of existing on the market systems are shown and the newest, often still under development, solutions are analysed. Potential and limitation of each method are presented and challenges of the whole branch of structural electronics manufacturing are shown.

Paper Details

Date Published: 6 November 2019
PDF: 6 pages
Proc. SPIE 11176, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2019, 111765F (6 November 2019); doi: 10.1117/12.2536953
Show Author Affiliations
Bartłomiej Wałpuski, Warsaw Univ. of Technology (Poland)
Marcin Słoma, Warsaw Univ. of Technology (Poland)


Published in SPIE Proceedings Vol. 11176:
Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2019
Ryszard S. Romaniuk; Maciej Linczuk, Editor(s)

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