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Predicting stochastic defects across the process window
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Paper Abstract

A method is proposed for fast CDSEM screening of defect process windows. The concept of Tail CD is used to build defect correlation trends from limited sampling. The trends are extrapolated towards larger ensembles to overcome the throughput limitation of the CDSEM. Application of the methodology on 3 different use cases (square and hexagonal contact hole arrays and L/S pattern) was demonstrated and limitations discussed. The impact of experimental conditions such as illumination, resist choice and etch was investigated. The predicted process windows were verified for selected dies to check the accuracy of the prediction, which showed good agreement.

Paper Details

Date Published: 29 November 2019
PDF: 10 pages
Proc. SPIE 11147, International Conference on Extreme Ultraviolet Lithography 2019, 1114708 (29 November 2019); doi: 10.1117/12.2536898
Show Author Affiliations
Andreas Frommhold, IMEC (Belgium)
Dorin Cerbu, IMEC (Belgium)
Joost Bekaert, IMEC (Belgium)
Lieve Van Look, IMEC (Belgium)
Mark Maslow, ASML Netherlands B.V. (Netherlands)
Gijsbert Rispens, ASML Netherlands B.V. (Netherlands)
Eric Hendrickx, IMEC (Belgium)


Published in SPIE Proceedings Vol. 11147:
International Conference on Extreme Ultraviolet Lithography 2019
Toshiro Itani; Paolo A. Gargini; Patrick P. Naulleau; Kurt G. Ronse, Editor(s)

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