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A method to discriminate between upper and lower side material removal in double-side polishing
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Paper Abstract

In this work, we propose a method to discriminate between upper and lower side material removal during double side polishing of fused silica parts. It consists in engraving cone-shaped craters on the two sides, then measuring the profile of each crater before/after a polishing run. The comparison of the profiles leads to the thickness removed on each side during the run. The craters have been engraved using a CO2 laser and their profiles measured thanks to a nano-scratcher. We have evaluated that this method can determine material removal with an accuracy of about 1μm, is insensitive to a part repositioning error under the tip of about 35μm, and has a repeatability of 0.5μm. Finally, we have been able to measure effective removal differences of 2μm between the two sides.

Paper Details

Date Published: 15 November 2019
PDF: 7 pages
Proc. SPIE 11175, Optifab 2019, 1117506 (15 November 2019); doi: 10.1117/12.2536771
Show Author Affiliations
C. Maunier, CEA-Cesta (France)
M. Redien, CEA-Cesta (France)
B. Da Costa Fernandes, CEA-Cesta (France)
J. Neauport, CEA-Cesta (France)


Published in SPIE Proceedings Vol. 11175:
Optifab 2019
Blair L. Unger; Jessica DeGroote Nelson, Editor(s)

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