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3D imaging methods in quality inspection systems
Author(s): Andrzej Sioma
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Paper Abstract

This paper presents a review of methods used for acquisition of 3D images. Method used in 3D imaging in manufacturing quality inspection system are in detail disused. A specific classification of such methods into contact and contactless and into active and passive methods is given. Special attention is given for presentation examples of methods used for measurement and testing product in manufacturing systems. The summary of the work is a characteristic of the relationship between the measurement resolution and the size of the imaging field. This is a characteristic that allows you to choose the imaging method for the needs of the measurement task.

Paper Details

Date Published: 6 November 2019
PDF: 10 pages
Proc. SPIE 11176, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2019, 111760L (6 November 2019); doi: 10.1117/12.2536742
Show Author Affiliations
Andrzej Sioma, AGH Univ. of Science and Technology (Poland)


Published in SPIE Proceedings Vol. 11176:
Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2019
Ryszard S. Romaniuk; Maciej Linczuk, Editor(s)

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