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Proceedings Paper

High temperature baking process study in advanced mask cleaning
Author(s): Dejian Li; Fen Xue; Cong Lu; Wenjun Ling; Xuefei Qin; Jie Wang
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Paper Abstract

High temperature baking treatment is a method to remove chemical residue on mask before shipping to wafer fab. When developing advanced mask technology, we need to make sure the bake treatment have no side-effect to mask quality. In this investigation, some test has been devised to study the relation between baking process and mask registration, CD movement, repaired point, ion residue and cleaning performance. We also studied how to setup a stable and efficient bake process to make the mask making flow reasonable. The high temperature bake processes was tuned by different temperature, treatment loops setting and was put at different process position to verify the performance. In this paper, OMOG and EAPSM masks were chosen to test by different process condition.

Paper Details

Date Published: 26 September 2019
PDF: 8 pages
Proc. SPIE 11148, Photomask Technology 2019, 1114816 (26 September 2019); doi: 10.1117/12.2536622
Show Author Affiliations
Dejian Li, Semiconductor Manufacturing International Corp. (China)
Fen Xue, Semiconductor Manufacturing International Corp. (China)
Cong Lu, Semiconductor Manufacturing International Corp. (China)
Wenjun Ling, Semiconductor Manufacturing International Corp. (China)
Xuefei Qin, Semiconductor Manufacturing International Corp. (China)
Jie Wang, Semiconductor Manufacturing International Corp. (China)


Published in SPIE Proceedings Vol. 11148:
Photomask Technology 2019
Jed H. Rankin; Moshe E. Preil, Editor(s)

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