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Proceedings Paper

Particle distribution characterization on material removal uniformity in chemical mechanical polishing
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Paper Abstract

Chemical mechanical polishing (CMP) is the most important process for global planarization. The micro material removal and planarization of the optical surface is a complicated process, and the surface shape of optics is effected by kinematics, pressure, and chemical conditions. Moreover, it is a remarkable fact that the distribution characterization of polishing particles also has an important effect on material removal uniformity, especially for leather pad and Tin polishing lap. Large optics were always polished to a convex shape for the low density of valid abrasives in optic center. The porosity and grooves distribution of pad plays a major role in slurry delivering. The novel model of contact and material removal is presented in which pad characterization, and polishing particles delivery and distribution effects are included. With the modified pad asperity and optimized grooves, the particles have been inclined towards well-distributed, and experiments validated that the optic figure is significantly promoted.

Paper Details

Date Published: 15 November 2019
PDF: 7 pages
Proc. SPIE 11175, Optifab 2019, 111750A (15 November 2019); doi: 10.1117/12.2536289
Show Author Affiliations
Shijie Zhao, China Academy of Engineering Physics (China)
Ruiqing Xie, China Academy of Engineering Physics (China)
Xi’an Jiaotong Univ. (China)
Defeng Liao, China Academy of Engineering Physics (China)
Xianhua Chen, China Academy of Engineering Physics (China)
Qinghua Zhang, China Academy of Engineering Physics (China)
Jian Wang, China Academy of Engineering Physics (China)
Qiao Xu, China Academy of Engineering Physics (China)


Published in SPIE Proceedings Vol. 11175:
Optifab 2019
Blair L. Unger; Jessica DeGroote Nelson, Editor(s)

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