Share Email Print
cover

Proceedings Paper

EUVL is being inserted in manufacturing in 2019: What are the mask related challenges remaining?
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

As it has been widely announced by the leading foundries, and confirmed by ASML, EUV Lithography is being introduced into high volume manufacturing (HVM) since the beginning of this year, in order to enable a more cost-effective manufacturing for the 7nm logic technology node. Very soon, the next technology node will be introduced and the number of EUV layers at 5nm is expected to increase significantly. Although EUV masks are not regarded as the first critical issue for EUV introduction into HVM, several items with respect to EUV masks need more time for improvements, certainly for 5nm and beyond. This presentation will address several mask related items such as EUV pellicle, alternative absorber, EUV mask lifetime, etc... and finally anamorphic masks. This paper is reviewing the status and outlook for these remaining challenges.

Paper Details

Date Published: 29 August 2019
PDF: 5 pages
Proc. SPIE 11177, 35th European Mask and Lithography Conference (EMLC 2019), 111770A (29 August 2019); doi: 10.1117/12.2535821
Show Author Affiliations
Kurt Ronse, IMEC (Belgium)
Rik Jonckheere, IMEC (Belgium)
Emily Gallagher, IMEC (Belgium)
Vicky Philipsen, IMEC (Belgium)
Lieve Van Look, IMEC (Belgium)
Eric Hendrickx, IMEC (Belgium)
Ryoung Han Kim, IMEC (Belgium)


Published in SPIE Proceedings Vol. 11177:
35th European Mask and Lithography Conference (EMLC 2019)
Uwe F.W. Behringer; Jo Finders, Editor(s)

© SPIE. Terms of Use
Back to Top
PREMIUM CONTENT
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?
close_icon_gray