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Proceedings Paper

New applications of electronic speckle pattern interferometry in novel materials and structures
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Paper Abstract

Electronic Speckle Pattern Interferometry (ESPI) is a full-field technique based on interferometry that has found applications in a wide range of domains mostly related in the field of non-destructive testing. The continuous progress of electronics, image analysis and processing has allowed during the last years this technique to expand its application horizons. In this contribution we review the use of ESPI as optical metrology tool for new industrial applications, biomaterials and non-destructive evaluation technique for novel materials. For the first topic different examples found in literature have been shown and discussed. In fact, ESPI has been successfully employed for assessing the integrity of stainless steel kegs or for measuring the deformation of the surface of a heated mirror, and also for evaluating residual stress fields in pipes. Further interesting studies were about thermomechanical behavior of a Printed Wired Board. Biomedical field can benefit of ESPI technology since ESPI has been employed for measuring surface displacements during inflation testing of ocular tissues or to assessing strain in bone-implant interfaces. Finally, one more example of application regarding non-destructive testing technique describes some interesting results for characterizing novel “green” and thus sustainable composite materials.

Paper Details

Date Published: 21 June 2019
PDF: 8 pages
Proc. SPIE 11059, Multimodal Sensing: Technologies and Applications, 1105910 (21 June 2019); doi: 10.1117/12.2527997
Show Author Affiliations
Vito Pagliarulo, Istituto di Scienze Applicate e Sistemi Intelligenti "Eduardo Caianiello" (Italy)
Pietro Ferraro, Istituto di Scienze Applicate e Sistemi Intelligenti "Eduardo Caianiello" (Italy)

Published in SPIE Proceedings Vol. 11059:
Multimodal Sensing: Technologies and Applications
Ettore Stella, Editor(s)

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