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Proceedings Paper

Modelling and fabrication of novel SERS sensor chips for chemical and biological sensing applications
Author(s): Yashna Sharma; Rajib R. Ghosh; Mangesh Jaiswal; Anuj Dhawan
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Paper Abstract

This paper presents hybrid plasmonic substrates fabricated by a combination of bottom-up and top-down process of fabrication which can be employed as efficient Surface enhanced Raman scattering (SERS) substrates for chemical sensing. The hybrid approach leads to a cost-efficient fabrication with smaller fabrication times than the pure top-down approach and higher degree of control than the pure bottom-up approach. We demonstrate the achievement of sub-20 nm gaps on a large area with this hybrid methodology. These small gaps lead to the formation of electromagnetic hotspots, i.e., regions of high electromagnetic enhancement. The electromagnetic behavior of these substrates is analyzed theoretically using Finite Difference Time Domain modeling. The sub-20 nm gaps lead to the electromagnetic SERS enhancements of the order of ∼108, and a change in the gap size can tune the plasmon resonance wavelength from the visible to the near-IR region of the spectrum. It is thus shown that these SERS substrates offer high SERS enhancement along with a capability of passive tunability of the plasmon resonance wavelength by changing the geometrical parameters in these substrates.

Paper Details

Date Published: 11 April 2019
PDF: 10 pages
Proc. SPIE 11028, Optical Sensors 2019, 1102830 (11 April 2019); doi: 10.1117/12.2524931
Show Author Affiliations
Yashna Sharma, Indian Institute of Technology Delhi (India)
Delhi Technological Univ. (India)
Rajib R. Ghosh, Indian Institute of Technology Delhi (India)
Mangesh Jaiswal, Indian Institute of Technology Delhi (India)
Anuj Dhawan, Indian Institute of Technology Delhi (India)


Published in SPIE Proceedings Vol. 11028:
Optical Sensors 2019
Francesco Baldini; Jiri Homola; Robert A. Lieberman, Editor(s)

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