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Proceedings Paper

Automated approach to the analysis of geometric parameters of MEMS elements
Author(s): N. Izrailev; A. Kazachkov; I. Rod; A. Isachenko; D. Shamiryan
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Paper Abstract

Modern high-tech MEMS manufacturing is not able to function without developed system of quality monitoring. Wellmanaged quality monitoring system enables to predict production risks and minimize them effectively. We devoted our research to such quality measurement tool as monitoring of product’s geometrical parameters between different MEMS manufacturing stages. This paper presents an example of automated approach to the analysis of optical images with the aim to control critical dimensions (CD) of MEMS products. For the purpose of CD monitoring, the special software has been developed. It executes several algorithms, such as image segmentation and Deriche edge detection, which allow to process one or several of images in a resource-saving manner. These algorithms were tested on both the interprocess control of critical dimensions and the control of kerf width and chipping after dicing technological process. As the result of their applying, huge-sized images (2 GB) are being processed in time less than 2 minutes and full optical inspection takes less than 10 minutes per wafer.

Paper Details

Date Published: 15 March 2019
PDF: 7 pages
Proc. SPIE 11022, International Conference on Micro- and Nano-Electronics 2018, 110220T (15 March 2019); doi: 10.1117/12.2521986
Show Author Affiliations
N. Izrailev, MAPPER LLC (Russian Federation)
Moscow Institute of Physics and Technology (Russian Federation)
A. Kazachkov, MAPPER LLC (Russian Federation)
I. Rod, MAPPER LLC (Russian Federation)
A. Isachenko, MAPPER LLC (Russian Federation)
D. Shamiryan, MAPPER LLC (Russian Federation)


Published in SPIE Proceedings Vol. 11022:
International Conference on Micro- and Nano-Electronics 2018
Vladimir F. Lukichev; Konstantin V. Rudenko, Editor(s)

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