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Proceedings Paper

High efficiency silicon-on-insulator fiber-chip spot size converting edge coupler
Author(s): Bo Liu; Gang Yang; Smit Desai; Keith Powell; Walter Xie; Liwei Li; Xiaoke Yi
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Paper Abstract

A fiber-chip spot size converting edge coupler has been presented on silicon-on-insulator (SOI) platform. The design is optimized for the wavelength of 1.55 μm using a fully-vectorial three-dimensional eigenmode expansion method. The proposed coupler combines an inverse taper edge coupler and a mode expander on a 220-nm-thick SOI platform. Results show that our proposed coupler could achieve an output profile of 10.4 μm×220 nm and 90% coupling efficiency operating for both transverse-electric and transverse-magnetic polarizations.

Paper Details

Date Published: 14 February 2019
PDF: 4 pages
Proc. SPIE 11048, 17th International Conference on Optical Communications and Networks (ICOCN2018), 1104833 (14 February 2019); doi: 10.1117/12.2521765
Show Author Affiliations
Bo Liu, The Univ. of Sydney (Australia)
Gang Yang, The Univ. of Sydney (Australia)
Smit Desai, The Univ. of Sydney (Australia)
Keith Powell, The Univ. of Sydney (Australia)
Walter Xie, The Univ. of Sydney (Australia)
Liwei Li, The Univ. of Sydney (Australia)
Xiaoke Yi, The Univ. of Sydney (Australia)


Published in SPIE Proceedings Vol. 11048:
17th International Conference on Optical Communications and Networks (ICOCN2018)
Zhaohui Li, Editor(s)

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