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Proceedings Paper

Rapid prototyping of single-photon-sensitive backside-illuminated silicon avalanche photodiode arrays
Author(s): Kevin K. Ryu; K. Alexander McIntosh; Steven Rabe; Joseph Ciampi; Renee D. Lambert; Rabindra Das; Bradley Felton; David Volfson; Christopher W. Leitz; Daniel R. Schuette; Brian F. Aull
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Paper Abstract

We have developed a new approach for rapid die-level hybridization of backside-illuminated silicon avalanche photodiode (APD) arrays to CMOS readout integrated circuits (ROICs). APD arrays are fabricated on a custom silicon-on-insulator (SOI) wafer engineered with a built-in backside contact and passivation layer. The engineered APD substrate structure facilitates uniform APD substrate removal by selective etching at the die level after bump bonding. The new integration process has the following advantages over wafer-level 3D integration: 1) reduced cost per development cycle since a dedicated full-wafer ROIC fabrication is not needed, 2) compatibility with existing ROICs that are in chip-format from previous fabrication runs, and 3) accelerated schedule. The new approach is applied to produce 32×32 100-μm-pitch silicon GmAPD arrays. Electrical performance of the APD arrays show 100% pixel connectivity and excellent yield before and after substrate removal.

Paper Details

Date Published: 13 May 2019
PDF: 8 pages
Proc. SPIE 10980, Image Sensing Technologies: Materials, Devices, Systems, and Applications VI, 109800L (13 May 2019); doi: 10.1117/12.2520798
Show Author Affiliations
Kevin K. Ryu, MIT Lincoln Lab. (United States)
K. Alexander McIntosh, MIT Lincoln Lab. (United States)
Steven Rabe, MIT Lincoln Lab. (United States)
Joseph Ciampi, MIT Lincoln Lab. (United States)
Renee D. Lambert, MIT Lincoln Lab. (United States)
Rabindra Das, MIT Lincoln Lab. (United States)
Bradley Felton, MIT Lincoln Lab. (United States)
David Volfson, MIT Lincoln Lab. (United States)
Christopher W. Leitz, MIT Lincoln Lab. (United States)
Daniel R. Schuette, MIT Lincoln Lab. (United States)
Brian F. Aull, MIT Lincoln Lab. (United States)

Published in SPIE Proceedings Vol. 10980:
Image Sensing Technologies: Materials, Devices, Systems, and Applications VI
Nibir K. Dhar; Achyut K. Dutta; Sachidananda R. Babu, Editor(s)

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