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Proceedings Paper

Novel approach to sub-5-nm patterning platforms: the self-assembly of metal conjugated bio-inspired molecules
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Paper Abstract

The manufacturable integration of geometric, equivalent and 3D scaling will drive Future Beyond CMOS devices and information processing technologies and systems. Additionally, interface control and low-energy functional patterning of non-traditional materials will enable the integration of novel heterogeneous 3D materials and systems. For future patterning technologies, resolution and defectivity, as well as line edge and interface roughness continue as key potential show-stoppers. Furthermore, the current resist-based patterning strategy requires a subsequent pattern transfer step, which adds to the stochastic nature and variability of the patterning and pattern transfer processes, and the challenge of achieving low defect sub-10 nm patterns will only increase with each technology generation. The Internet-of-Things era opens an enormous research space and opportunity for exploring emerging research materials (ERMs) that exhibit the potential for achieving sub-8-nm functional feature sizes via the directed self-assembly of novel non-block copolymer (BCP) and nanomaterials. Utilizing intramolecular hydrophilic-hydrophobic interactions as a driving force for self-assembly, we designed and developed a method to fabricate molecular patterning platforms that leverage interactions between bioinspired amphiphilic molecules and various metal cation-conjugates. This system also appears to exhibit a dynamic chi, χ, during the assembly process, which would enhance the formation of highly resolved self-assembled structures. With this method, we were able to demonstrate 2.9±0.8 nm (1σ; n=11) ordered metal/organic line patterns, with a pitch of 7.4±2.0 nm (1σ; n=10), and conductivity through the metal nanowires. While still in the ‘ugly duckling’ stage of development, this study demonstrates the feasibility of achieving self-assembled sub-4 nm functional nanostructures. This breakthrough technology opens the door to new families of self-assembling materials options, with the potential to serve as an inexpensive and effective way to pattern high-resolution features, such as for nanoelectronics, bioelectronics and other emerging 21st century information processing technologies.

Paper Details

Date Published: 5 June 2019
PDF: 10 pages
Proc. SPIE 10958, Novel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019, 1095811 (5 June 2019); doi: 10.1117/12.2518995
Show Author Affiliations
Hemali Rathnayake, The Univ. of North Carolina at Greensboro (United States)
Gayani Pathiraja, The Univ. of North Carolina at Greensboro (United States)
Daniel Herr, The Univ. of North Carolina at Greensboro (United States)


Published in SPIE Proceedings Vol. 10958:
Novel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019
Martha I. Sanchez; Eric M. Panning, Editor(s)

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