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Proceedings Paper

Fully integrated ultra-compact 3D microtube devices (Conference Presentation)
Author(s): Oliver G. Schmidt

Paper Abstract

Self-assembled rolled-up microtubes are exploited to rigorously compact 2D devices into 3D microarchitectures. We demonstrate integration of transistors, integrated circuitry as well as electronic, photonic and magnetic components into microtube devices for sensor arrays and novel device platforms such as lab-in-a-tube systems. In combination with self-wound energy storage units our work bridges lengthscales for a new generation of high performance electronic microdevices.

Paper Details

Date Published: 16 August 2019
Proc. SPIE 10958, Novel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019, 1095808 (16 August 2019); doi: 10.1117/12.2518395
Show Author Affiliations
Oliver G. Schmidt, Leibniz IFW Dresden (Germany)

Published in SPIE Proceedings Vol. 10958:
Novel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019
Martha I. Sanchez; Eric M. Panning, Editor(s)

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