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Proceedings Paper

Persistent homology analysis of complex high-dimensional layout configurations for IC physical designs
Author(s): Yacoub Kureh; Vito Dai; Luigi Capodieci
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Paper Abstract

Problems in simulation, in physical defects, or in electrical failures of the IC devices generally occur at the boundaries of dimensional tolerances, such as the minimum width and space. However, for layout configurations with four or more critical dimensions, simple minimums are insufficient to characterize dimensional coverage. Persistent homology is a multi-resolution analysis technique which robustly summarizes dimensional coverage. We apply this technique to compare dimensional coverage of IC design configurations, on the same layer, on different layers, and on different designs, yielding results both expected and unexpected based on manufacturing process and design rule knowledge.

Paper Details

Date Published: 20 March 2019
PDF: 10 pages
Proc. SPIE 10962, Design-Process-Technology Co-optimization for Manufacturability XIII, 1096207 (20 March 2019); doi: 10.1117/12.2516583
Show Author Affiliations
Yacoub Kureh, Univ. of California, Los Angeles (United States)
Motivo, Inc. (United States)
Vito Dai, Motivo, Inc. (United States)
Luigi Capodieci, Motivo, Inc. (United States)

Published in SPIE Proceedings Vol. 10962:
Design-Process-Technology Co-optimization for Manufacturability XIII
Jason P. Cain, Editor(s)

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