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Proceedings Paper

Improved wafer alignment model algorithm for better on-product overlay
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Paper Abstract

To support the manufacturing of DRAM semiconductors for next and future nodes, there is a constant need to reduce the overlay fingerprints. In this paper we evaluate algorithms which are capable of decoupling wafer deformation from mark deformation and extrapolation effects. The algorithms enable lithography tools to use only the wafer deformation component in the alignment feedforward correction. Therefore improving the (wafer to wafer) overlay. First results will be shared showing improvement of wafer to wafer variation in high-volume manufacturing environment.

Paper Details

Date Published: 20 March 2019
PDF: 10 pages
Proc. SPIE 10961, Optical Microlithography XXXII, 109610A (20 March 2019); doi: 10.1117/12.2516259
Show Author Affiliations
Ik-Hyun Jeong, SK Hynix, Inc. (Korea, Republic of)
Hyun-Sok Kim, SK Hynix, Inc. (Korea, Republic of)
Yeong-Oh Kong, SK Hynix, Inc. (Korea, Republic of)
Ji-Hyun Song, SK Hynix, Inc. (Korea, Republic of)
Jae-Wuk Ju, SK Hynix, Inc. (Korea, Republic of)
Young-Sik Kim, SK Hynix, Inc. (Korea, Republic of)
Cees Lambregts, ASML Netherlands B.V. (Netherlands)
Miao Yu, ASML Netherlands B.V. (Netherlands)
Rizvi Rahman, ASML Netherlands B.V. (Netherlands)
Leendertjan Karssemeijer, ASML Netherlands B.V. (Netherlands)
Elliott McNamara, ASML Netherlands B.V. (Netherlands)
Paul Böcker, ASML Netherlands B.V. (Netherlands)
Jong-Cheol Choi, ASML Korea Co., Ltd. (Korea, Republic of)
Nang-Lyeom Oh, ASML Korea Co., Ltd. (Korea, Republic of)
Kang-San Lee, ASML Korea Co., Ltd (Korea, Republic of)
Jin-Seo Lee, ASML Korea Co., Ltd. (Korea, Republic of)


Published in SPIE Proceedings Vol. 10961:
Optical Microlithography XXXII
Jongwook Kye; Soichi Owa, Editor(s)

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