We propose a novel combined measurement system for measuring surface and thickness profiles of multi-layered film specimens named as MYFIELM (Measurement sYstem of Film structure by Interferometry and ELlipsoMetry). Film thickness profiles measured by ellipsometry mode are transferred to interferometry mode in MYFIELM and the surface profile can be extracted from the spectral phase of the interferometry containing both of surface height and film thicknesses. For the verification, each performance of the operating mode was confirmed and 4 film layered specimen was measured in comparison of the reference values. To the best of our knowledge, MYFIELM is the most suitable solution for characterizing thin film structures with a textured substrate without any damage on the specimen compared with the previous techniques even though it needs further improvements for stability and reliability.

Date Published: 26 March 2019
PDF: 9 pages
Proc. SPIE 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII, 1095927 (26 March 2019); doi: 10.1117/12.2516148

Published in SPIE Proceedings Vol. 10959:
Metrology, Inspection, and Process Control for Microlithography XXXIII
Vladimir A. Ukraintsev; Ofer Adan, Editor(s)