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Proceedings Paper

Development of metal organic cluster EUV photoresists
Author(s): Kazunori Sakai; Seok Heon Jung; Wenyang Pan; Emmanuel P. Giannelis; Christopher K. Ober
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Paper Abstract

Extreme ultraviolet (EUV) lithography, using 13.5 nm radiations, is almost ready for high volume manufacturing. EUV lithography is expected to be the main technology for manufacturing leading-edge devices and continuous improvement of lithography performance is still needed. We have developed several metal oxide containing resists and recently focused on metal organic cluster photoresists with controlled size distribution. In this paper, material properties and lithography performance of our new metal organic cluster photoresists are discussed.

Paper Details

Date Published: 25 March 2019
PDF: 5 pages
Proc. SPIE 10960, Advances in Patterning Materials and Processes XXXVI, 1096015 (25 March 2019); doi: 10.1117/12.2516133
Show Author Affiliations
Kazunori Sakai, Cornell Univ. (United States)
JSR Corp. (Japan)
Seok Heon Jung, Cornell Univ. (United States)
Wenyang Pan, Cornell Univ. (United States)
Emmanuel P. Giannelis, Cornell Univ. (United States)
Christopher K. Ober, Cornell Univ. (United States)

Published in SPIE Proceedings Vol. 10960:
Advances in Patterning Materials and Processes XXXVI
Roel Gronheid; Daniel P. Sanders, Editor(s)

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