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Proceedings Paper

Electrical validation of the integration of 193i and DSA for sub-20nm metal cut patterning
Author(s): Chi-Chun Liu; Richard Farrell; Kafai Lai; Yann Mignot; Eric Liu; Jing Guo; Yasuyuki Ido; Makoto Muramatsu; Nelson Felix; David Hetzer; Akiteru Ko; John Arnold; Daniel Corliss
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Paper Abstract

The progress of using DSA for metal cut to achieve sub-20nm tip-to-tip (t2t) critical dimension (CD) is reported. Small and uniform t2t CD is very challenging due to lithographic limitation but holds the key to backend-of-the-line (BEOL) scaling. An integration scheme is demonstrated that allows the combination of design flexibility and fine, rectified local CD uniformity (LCDU). Functional electrical testable Via-Chain structure is fabricated to verify the integrity of the proposed method. Through the analysis of the observed failure modes, the process is further improved. By validating DSA for such an important patterning element as metal cut, the DSA maturity can be further advanced and hopefully move DSA closer to HVM adoption.

Paper Details

Date Published: 26 March 2019
PDF: 9 pages
Proc. SPIE 10958, Novel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019, 109580L (26 March 2019); doi: 10.1117/12.2515862
Show Author Affiliations
Chi-Chun Liu, IBM Research–Albany NanoTechnology (United States)
Richard Farrell, TEL Technology Ctr., America, LLC (United States)
Kafai Lai, IBM Research–Albany NanoTechnology (United States)
Yann Mignot, IBM Research–Albany NanoTechnology (United States)
Eric Liu, TEL Technology Ctr., America, LLC (United States)
Jing Guo, IBM Research–Albany NanoTechnology (United States)
Yasuyuki Ido, Tokyo Electron Kyushu Ltd. (Japan)
Makoto Muramatsu, Tokyo Electron Kyushu Ltd. (Japan)
Nelson Felix, IBM Research–Albany NanoTechnology (United States)
David Hetzer, TEL Technology Ctr., America, LLC (United States)
Akiteru Ko, TEL Technology Ctr., America, LLC (United States)
John Arnold, IBM Research–Albany NanoTechnology (United States)
Daniel Corliss, IBM Research–Albany NanoTechnology (United States)


Published in SPIE Proceedings Vol. 10958:
Novel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019
Martha I. Sanchez; Eric M. Panning, Editor(s)

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