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Proceedings Paper

Quantifying global and local CD variation for an advanced 3D NAND layer (Conference Presentation)

Paper Abstract

All chipmakers understand that variability is the adversary of any process and reduction is essential to improving yield which translates to profit. Aggressive process window and yield specifications necessitate tight inline variation requirements on the DUV light source which impact scanner imaging performance. Improvements in reducing bandwidth variation have been realized with DynaPulse™ bandwidth control technology as significant reduction in bandwidth variation translates to a reduction in CD variation for critical device structures. Previous work on a NAND Via layer has demonstrated an improvement in process capability through improve source and mask optimization with greater ILS and reduced MEEF that improved CDU by 25%. Using this Via layer, we have developed a methodology to quantify the contribution in an overall CDU budget breakdown. Data from the light source is collected using SmartPulse™ allowing for the development of additional methodologies using predictive models to quantify CD variation from Cymer’s legacy, DynaPulse 1 and DynaPulse 2 bandwidth control technologies. CD non-uniformities due to laser bandwidth variation for lot to lot, wafer to wafer, field to field and within field is now available based on known sensitivities and modeled. This data can assist in understanding the contribution from laser bandwidth variation in global and local CDU budgets.

Paper Details

Date Published: 18 March 2019
Proc. SPIE 10961, Optical Microlithography XXXII, 109610J (18 March 2019); doi: 10.1117/12.2515725
Show Author Affiliations
Will Conley, Cymer, LLC (United States)
Yaobin Feng, Yangtze Memory Technologies Co., Ltd. (China)
Zhiyang Song, Yangtze Memory Technologies Co., Ltd. (China)
Moran Guo, Yangtze Memory Technologies Co., Ltd. (China)
Jun He, Yangtze Memory Technologies Co., Ltd. (China)
Longxia Guo, Yangtze Memory Technologies Co., Ltd. (China)
Gang Xu, Yangtze Memory Technologies Co., Ltd. (China)
Simon Hsieh, Cymer, LLC (United States)
James Bonafede, Cymer, LLC (United States)
Stephen Hsu, ASML Brion Technologies (United States)
Austin Peng, ASML Brion Technologies (United States)
Jun Wei Lu, ASML Intl. Trading Co., Ltd. (China)
Victor Peng, ASML Intl. Trading Co., Ltd. (China)
Beeri Nativ, ASML Netherlands B.V. (Netherlands)
Fei Jia, ASML Netherlands B.V. (Netherlands)
Herman Nicolai, ASML Netherlands B.V. (Netherlands)
Ijen van Mil, ASML Netherlands B.V. (Netherlands)

Published in SPIE Proceedings Vol. 10961:
Optical Microlithography XXXII
Jongwook Kye; Soichi Owa, Editor(s)

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