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Proceedings Paper

Evaluation of adhesion layers performances for soft UV nanoimprint lithography
Author(s): F. Delachat; H. Teyssedre; L. Pain; X. Chevalier; Célia Nicolet; Christophe Navarro
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Paper Abstract

In this work, an evaluation of various adhesion promoters (or primers) for soft ultra-violet (UV) nanoimprint lithography (NIL) is reported. The evaluation is performed using 200 mm wafer scale in the HERCULES® NIL equipment platform available at the CEA-Leti. First, surface energies of the primers are determined through contact angle measurements. Next, atomic force microscope (AFM) measurements were carried out to evaluate the surface uniformity and roughness of the primed wafers. Thin film thickness measurements were performed by spectroscopic ellipsometry in order to select the most promising primer processes for high resolution etch mask and permanent applications. Afterwards, the adhesion layer performances of the selected primer processes were evaluated by an imprint test using a dedicated patterned master (critical dimension down to 30 nm and aspect ratios up to 1.5). Optical and scanning electron microscope (SEM) defect reviews were systematically performed. This evaluation enabled to benchmark several adhesion promotor solutions based on the grafted technology developed by ARKEMA in order to identify an efficient adhesive layer compatible with various NIL resists and substrates, such as silicon based materials or glass.

Paper Details

Date Published: 26 March 2019
PDF: 7 pages
Proc. SPIE 10958, Novel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019, 1095816 (26 March 2019); doi: 10.1117/12.2515607
Show Author Affiliations
F. Delachat, CEA-LETI (France)
Intitek for Industry (France)
H. Teyssedre, CEA-LETI (France)
L. Pain, CEA-LETI (France)
X. Chevalier, Arkema S.A. (France)
Célia Nicolet, Arkema S.A. (France)
Christophe Navarro, Arkema S.A. (France)

Published in SPIE Proceedings Vol. 10958:
Novel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019
Martha I. Sanchez; Eric M. Panning, Editor(s)

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